The main purposes of this process tool are removal of
moisture from substrates and/or the bake out/curing of
coated layers. Depending on the application the maximum
temperature can vary between 60°C up to 450°C.
Several options are available which have to be chosen
depending on the application:
Lifting pins
Required option once the hot plates are supposed to be
loaded with a robot.
Proximity heating
For sensitive baking and for simulation of temperature
ramping and vacuum contact the heating method of proximity
heating is used. The lifting pins are driven with a servo
motor in a vertical,
parallel movement. During the movement all lifting pins
stay in one plane.
Vacuum suction
For immediate contact between substrate and hot plate.
Vacuum chamber
The hot plate is integrated into a vacuum chamber. In this
setup an under pressure bake and an under pressure purge
mode can be realized. The minimum pressure is < 0,1
mbar
Wall heating
Surrounding chamber walls of hotplate are heated to prevent
condensation of solvent vapors.
Cooling function
The hot plate can be equipped with an integrated cooling
circuit which can be run either with water or even liquid
nitrogen. This setup enables the operator to perform a
rapid cool down of the
substrate to sub-zero temperatures without changing the
process station.
Glovebox integrated hot plate / cool plate systems
